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Polysciences, Inc. is a US owned small business enterprise. • Chemical process development and chemical manufacturing of materials for ongoing manufacturing programs and to accelerate R&D. • Manufacturing capabilities and facilities (>200,000 ft^2; full analytical instrumentation) for chemical synthesis and formulation on volumes from hundreds of grams (100 g) to thousands of kilograms (1000+ kg). • Specialize in manufacturing non-commodity chemicals (small molecules, monomers, polymers) for defense, electronics, pharmaceutical, medical devices, etc. ISO and FDA certified Products EW8004 NoSWEEP™ Wire Bond Encapsulant NoSweep ™ EW8004 is a high performance encapsulant useful on sensitive aerospace systems. The product`s low temperature curing capabilities make it suitable for encapsulating sensitive devices and components. Catalog No. EW8004-10 UC5001 EasyFILL™ EZ Fill ™ UC5001 is a low viscosity under fill sealant for encapsulation of printed circuit board to semi conductor chip connections. Its dimensional stability, and high durability make it very useful for demanding under fill assemblies. Catalog No. UC5001 Visit us at Booth #912