Teledyne Advanced Electronic Solutions provides custom engineered solutions for your complex electronic packaging challenges. We have excelled in integrating both 1st level and 2nd level interconnect technologies with all its associated advanced process engineering and manufacturing automation, From complex circuit card, module, box level assembly and test to creative microelectronics packaging, from single chip packaging to most complex box level assemblies, we offer the most advanced manufacturing solutions. We are committed to providing innovative technologies to the aerospace, space, defense and high-tech industries, backed by unparalleled service and support.