Booth
# 329

GLOBAL CIRCUIT INNOVATIONS INC

Global Circuit Innovations (GCI) and DPACI will be sharing booth 329# to offer our Die Extraction and Reassembly (DER) Turn Key solutions to resolve high reliable obsolete part in legacy systems. This cost-effective proprietary solution allows us to provide obsolete or hard-to-find ICs that are no longer manufactured in the required pin-outs or hermetic packages. Our DER processes allow GCI and DPACI to remove a die from an existing plastic part and repackage it into a ceramic, metal, or hybrid package. As part of our DER process, we also screen the complete components to MIL-STD-883 Class B or Class S procedures. DER parts can satisfy form, fit, function, quality, and reliability requirements for replacement of military or aerospace components. These replacement parts can save millions of dollars over redesign and manufacturing a military grade device for boards or assemblies. In addition, the delivery is virtually immediate if the plastic COTS part is readily available. We can provide engineering units within days as candidates for your evaluation. GCI and DPACI's DER processes always include electrical test with read and recorded data to validate authenticity of the dice. The USAF has approved a study to qualify GCI and DPACI processes as a game changer for the USAF Mission Impaired Capability Awaiting Parts (MICAP) events.