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Corfin provides component lead preparation with Sn/Pb robotic hot solder dipping, BGA reballing, trim and form, lead attach and reconditioning, component harvesting, long term storage, kitting and test services to eliminate tin whisker risk, gold embrittlement, mixed metallization, TCE mismatch, oxidation and other causes of poor quality solder joints to prevent catastrophic failure in mission and life critical systems.