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Teledyne Microelectronics is a full service microelectronics contract manufacturer offering innovative approaches in high density packaging and testing of microcircuits, multichip modules and multichip assemblies. At our Advanced Manufacturing Prototype Center in Los Angeles, California and our Production Facility in Lewisburg, Tennessee, we specialize in high density microminiature devices utilizing the latest advanced packaging techniques. We are certified to IS09001:2008, MIL-PRF-38534 Class "H" and accredited by the DoD as a Trusted Source for Microelectronics Packaging, Assembly and Test. We are committed to bringing reliability, precision, performance and innovation to every microelectronics packaging project.